⚠ The Lead Is Measurably NarrowerHigh threat

SK hynix (SKHY) — threat to the moat

DRAM share fell from 34.8 percent to 29.1 percent in a single quarter -- during the strongest demand this industry has ever recorded, which is the least comfortable way to lose share.

The single most important number on any of these pages is SK hynix's share of HBM, and it is falling.

SK hynix share of DRAM revenue29.9%202333.4%202434.8%202529.1%Q1 2026IDC. The fall happened during the strongest demand memory has ever recorded.
Share surrendered in a shortage is the least comfortable way to lose it.

The company's own filing puts it at 56.4% in the first quarter of 2026 — first place, comfortably1. The number that ought to worry an owner is one level up, in the same report: SK hynix's share of the whole DRAM market went 29.9% in 2023, 33.4% in 2024, 34.8% in 2025, and then 29.1% in the first quarter of 20262. Nearly six points surrendered in a single quarter, during the strongest demand in the industry's history.

This is what should be expected rather than what should be shocking. SK hynix's lead came from being roughly a generation early on a product that everybody could see was about to be enormously valuable. Two competitors with comparable fabs, comparable engineers and every incentive were always going to close some of that gap. The question was never whether, but how much and how fast.

What makes it consequential is the valuation arithmetic. Ordinary DRAM is a commodity that earns a commodity return over a cycle. Essentially the entire case for SK hynix being worth more than a cyclical multiple of cyclical earnings rests on the part of the business that is not ordinary DRAM. Share loss in HBM is therefore not a small operational disappointment; it is a transfer of the company from one valuation category to another.

There is a real mitigation, and it is arithmetic rather than optimism: a shrinking share of a market forecast to grow from about US$33 billion to US$86 billion in two years3 still produces rapid absolute growth. Some of that share was not lost to a better product — it was ceded because SK hynix could not build fast enough to hold it.

The falsifier is simple and public. If HBM share by revenue drops below half, SK hynix is no longer the HBM company — it is the largest of three HBM companies, which is a different investment.

References
  1. Third-party estimate56.4% of HBM revenue in the first quarter of 2026 — first place globally, per IDC.
    SK hynix Inc., Form 424B4 prospectus for its Nasdaq offering (SEC, CIK 2120882) — FY2025 revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, S&A W 5,019bn, R&D W 6,466bn and profit for the year W 42,948bn, against FY2024 revenue W 66,193bn / profit W 19,797bn and FY2023 revenue W 32,766bn / cost of sales W 33,299bn / gross loss W 533bn / loss for the year W 9,138bn; Q1 2026 revenue W 52,576bn, gross profit W 41,679bn, profit W 40,346bn. IDC market shares for Q1 2026: second in DRAM at 29.1%, first in HBM at 56.4%, second in NAND at 18.5%, with the three DRAM producers together above 90% of revenue. DRAM products were 77.1% of total sales in 2025 and 77.3% in Q1 2026; NAND 21.3% and 22.0%. Competitors named: Samsung Electronics, Micron Technology and CXMT in DRAM; Samsung Electronics, Kioxia, Micron Technology and Sandisk in NAND; competitive factors listed as 'pricing; manufacturing costs, yields and product availability; product performance, quality and reliability'. First to develop HBM using TSV packaging, commercialised HBM3E in 2024 and developed HBM4 in 2025; HBM carried a per-gigabyte price premium of more than five times traditional DRAM in 2025. M15X cleanroom opened October 2025 with wafer input from Q1 2026; Yongin construction began February 2025 with the first fab's phase-one cleanroom expected Q1 2027; an advanced packaging plant (P&T7) is under construction in Cheongju and one is planned in Indiana for the second half of 2028. Intel's NAND business cost US$6.6bn in December 2021 plus US$2.2bn in March 2025, operated as Solidigm; NAND mass production is transitioning from 176-layer to 238- and 321-layer technologies. Gartner forecasts DRAM revenue of US$143bn in 2025 rising to US$401bn in 2027, HBM US$33bn to US$86bn and NAND US$68bn to US$341bn. A substantial portion of sales is attributable to a limited number of customers located in the United States and China; the two largest were 14.8% and 12.4% of revenue in Q1 2026 and the largest was 23.9% of revenue in 2025. The offering was 177,900,000 ADSs at US$149.00, each ADS one-tenth of a common share, representing 17,790,000 shares against 712,702,365 outstanding; Baillie Gifford, Coatue and Situational Awareness Partners indicated non-binding interest of up to US$7bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
  2. Third-party estimateDRAM share of 29.9% in 2023, 33.4% in 2024, 34.8% in 2025 and 29.1% in the first quarter of 2026.
    SK hynix Inc., semi-annual business report for the six months to 30 June 2026 (SEC Form 6-K, 18 August 2026) — 'The Company determines supply volumes and prices on a monthly and quarterly basis by mutual agreement with major customers, and there is no order backlog based on long term supply contracts.' Total equity W 262,693,228 million at 30 June 2026 against W 120,666,751 million at 31 December 2025; cash and cash equivalents, short-term financial instruments and short-term investment assets W 87,957,923 million against W 34,942,253 million; total borrowings W 18,586,634 million against W 22,247,905 million; debt-to-equity 32.80%, net borrowing ratio not disclosed because it is negative. For the six months to 30 June 2026, revenues of W 17,608,702 million (13.35%) and W 17,187,421 million (13.03%) were derived from external Customers A and B respectively; for the six months to 30 June 2025, W 10,890,639 million (27.31%) came from Customer A. IDC market share: DRAM 29.9% in 2023, 33.4% in 2024, 34.8% in 2025 and 29.1% in Q1 2026; NAND 19.6%, 21.4%, 20.9% and 18.5%. Gartner's world DRAM market: US$78.7bn in 2022 (-15.4%), US$49.9bn in 2023 (-36.5%), US$91.6bn in 2024 (+82.7%) and US$146.9bn in 2025 (+60.0%). Announced investments include approximately W 15 trillion for M15X in Cheongju, approximately W 19 trillion for the P&T7 advanced packaging plant and W 21,608.1 billion for Yongin, against long-term plans of roughly W 600 trillion for the Yongin cluster and W 100 trillion for Cheongju. The company developed the world's first 321-layer QLC NAND. China's State Administration for Market Regulation cleared the Intel NAND acquisition conditionally, obliging the group to maintain a reasonable pricing policy, increase production and support the entry of third-party competitors into the Chinese eSSD market for five years from December 2021. — six months to 30 June 2026 · publ. 2026-08-18 · source ↗
  3. Third-party estimateGartner forecasts HBM revenue rising from about US$33bn to US$86bn in two years.
    SK hynix Inc., Form 424B4 prospectus for its Nasdaq offering (SEC, CIK 2120882) — FY2025 revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, S&A W 5,019bn, R&D W 6,466bn and profit for the year W 42,948bn, against FY2024 revenue W 66,193bn / profit W 19,797bn and FY2023 revenue W 32,766bn / cost of sales W 33,299bn / gross loss W 533bn / loss for the year W 9,138bn; Q1 2026 revenue W 52,576bn, gross profit W 41,679bn, profit W 40,346bn. IDC market shares for Q1 2026: second in DRAM at 29.1%, first in HBM at 56.4%, second in NAND at 18.5%, with the three DRAM producers together above 90% of revenue. DRAM products were 77.1% of total sales in 2025 and 77.3% in Q1 2026; NAND 21.3% and 22.0%. Competitors named: Samsung Electronics, Micron Technology and CXMT in DRAM; Samsung Electronics, Kioxia, Micron Technology and Sandisk in NAND; competitive factors listed as 'pricing; manufacturing costs, yields and product availability; product performance, quality and reliability'. First to develop HBM using TSV packaging, commercialised HBM3E in 2024 and developed HBM4 in 2025; HBM carried a per-gigabyte price premium of more than five times traditional DRAM in 2025. M15X cleanroom opened October 2025 with wafer input from Q1 2026; Yongin construction began February 2025 with the first fab's phase-one cleanroom expected Q1 2027; an advanced packaging plant (P&T7) is under construction in Cheongju and one is planned in Indiana for the second half of 2028. Intel's NAND business cost US$6.6bn in December 2021 plus US$2.2bn in March 2025, operated as Solidigm; NAND mass production is transitioning from 176-layer to 238- and 321-layer technologies. Gartner forecasts DRAM revenue of US$143bn in 2025 rising to US$401bn in 2027, HBM US$33bn to US$86bn and NAND US$68bn to US$341bn. A substantial portion of sales is attributable to a limited number of customers located in the United States and China; the two largest were 14.8% and 12.4% of revenue in Q1 2026 and the largest was 23.9% of revenue in 2025. The offering was 177,900,000 ADSs at US$149.00, each ADS one-tenth of a common share, representing 17,790,000 shares against 712,702,365 outstanding; Baillie Gifford, Coatue and Situational Awareness Partners indicated non-binding interest of up to US$7bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
Sources
Generated September 23, 2026